Thermal conductive structural adhesive
Product Categories：Thermal conductive structural adhesive
Add Time：2023/4/11 15:34:40
Support Hotline：
18123914962
- Product Description
Changtian dual dosage fast curing thermal conductive structural adhesive,which is characterized by rapid curing,belongs to the patented advanced new material of rubber softened epoxy resin,and is one of the special varieties of the dual dosage silicon free thermal conductive structural adhesive system.It has multiple functions of heat conduction,insulation,semi-rigid bonding,and sealing.The use of glue dispenser construction,together with automatic production lines,can significantly improve the work efficiency and bonding quality,and is simple to use.
Thermal conductivity:3.5W/mk
Product features:
1.Modified epoxy thermal conductive structural adhesive can replace bolt components without mechanical tightening,simplifying the structure,reducing weight,and increasing energy density.
2.High bonding strength,≥8 MPa,capable of withstanding a 12m free fall speed of 120 km/h disaster impact.
3.Flame retardant grade UL 94-VO,extinguishing immediately after ignition.
4.The service temperature is as low as-45℃,with a rated temperature of 175℃,and can withstand 250℃for short periods of operation.
5.Dielectric strength≥10kV/mm,even up to 14kV/mm.
6.Compatible with high-capacity,automatic dispensing process.
Product Usage:
1.Dual dose fast setting thermal conductive structural adhesive is suitable for the bonding,thermal conductivity,insulation,and sealing of various materials.It is suitable for the thermal conductivity and insulation of structural component interfaces in high-end industries such as automobiles,security monitoring,and aerospace.
2.Designed for the integration of adhesive and thermal sealing between automotive power battery modules,water-cooled plates,and thermal conductive plates.
3.Structural materials used for bonding thermal conductive components in aircraft cabins and related parts.
4.Bonding heat conduction between semiconductor cooling fins,LED TV power amplifier tubes and cooling fins.
Shelf life:It can be stored for 6 months without opening at room temperature of 25℃.
Packaging specifications:50ML/piece,200ML/piece,400mL,large barrel packaging,etc.
Thermal conductivity:3.5W/mk
Product features:
1.Modified epoxy thermal conductive structural adhesive can replace bolt components without mechanical tightening,simplifying the structure,reducing weight,and increasing energy density.
2.High bonding strength,≥8 MPa,capable of withstanding a 12m free fall speed of 120 km/h disaster impact.
3.Flame retardant grade UL 94-VO,extinguishing immediately after ignition.
4.The service temperature is as low as-45℃,with a rated temperature of 175℃,and can withstand 250℃for short periods of operation.
5.Dielectric strength≥10kV/mm,even up to 14kV/mm.
6.Compatible with high-capacity,automatic dispensing process.
Product Usage:
1.Dual dose fast setting thermal conductive structural adhesive is suitable for the bonding,thermal conductivity,insulation,and sealing of various materials.It is suitable for the thermal conductivity and insulation of structural component interfaces in high-end industries such as automobiles,security monitoring,and aerospace.
2.Designed for the integration of adhesive and thermal sealing between automotive power battery modules,water-cooled plates,and thermal conductive plates.
3.Structural materials used for bonding thermal conductive components in aircraft cabins and related parts.
4.Bonding heat conduction between semiconductor cooling fins,LED TV power amplifier tubes and cooling fins.
Shelf life:It can be stored for 6 months without opening at room temperature of 25℃.
Packaging specifications:50ML/piece,200ML/piece,400mL,large barrel packaging,etc.